Creep-Fatigue Behavior of Microelectronic Solder Joints
نویسندگان
چکیده
منابع مشابه
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique
Solder joints in microelectronic are used for electrical signals transmission, heat conduction and structural support. One of the key problems referring to solders in microelectronics is reliability due to typical failure modes as creep and fatigue. The above paper focuses on the experimental measurements and corresponding analysis with the microindentation tests of the SAC 405 solder alloy due...
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Purpose – The aim of this work is the use of specially designed, authoring device to evaluate the strength of solder alloys commonly used in all kinds of electronic and electrical devices that are used in various fields of economic and industrial development to shorten the testing period. By obtaining answers to pervade science questions on how to properly investigate the reliability of solder ...
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With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-P WB system, accounting for ...
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ژورنال
عنوان ژورنال: MRS Proceedings
سال: 1991
ISSN: 0272-9172,1946-4274
DOI: 10.1557/proc-226-433